Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing report published by System Plus Consulting

©2018 by System Plus Consulting | TI LMG5200 1
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Texas Instruments LMG5200
80V GaN Power Stage
Power Semiconductor report by Elena Barbarini
February 2018 – sample

SUMMARY
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Texas Instruments
Physical Analysis 15
o Synthesis of the Physical Analysis
o Package analysis
 Package opening
 Package Cross-Section
o FET Die
 FET Die View & Dimensions
 FET Die Process
 FET Die Cross-Section
 FET Die Process Characteristic
o IC Die
 IC Die View & Dimensions
 IC Die Process
 IC Die Cross-Section
 IC Die Process Characteristic
Power Stage Manufacturing Process 63
o FET Die Front-End Process
o FET Die Fabrication Unit
o IC Die Front-End Process
o IC Die Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 85
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o FET die
 FET Front-End Cost
 FET Die Probe Test, Thinning & Dicing
 FET Wafer Cost
 FET Die Cost
o IC die
 IC Front-End Cost
 IC Die Probe Test, Thinning & Dicing
 IC Wafer Cost
 IC Die Cost
o Complete Power Stage
 Packaging Cost
 Final Test Cost
 Component Cost
Price Analysis 105
o Estimation of selling price
Comparison 108
o Comparison between Panasonic, Transphorm and
GaN Systems HEMT
Feedback 110
System Plus services 112

Overview / Introduction
o Executive Summary
o Market
o Reverse Costing
Methodology
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedback
About System Plus
Executive Summary
To minimize the parasites linked to high frequency operations and to propose a driver integrated solution, Texas Instruments
has introduced the first 80V Half bridge GaN FET power stage device in advanced QFM package.
In this report System Plus Consulting unveils TI’s technical choices; from the device design up to the packaging. It is the first
time that we can find a Half bridge design GaN FET with its driver, all assembled in an advanced multichip packaging.
The new LMG3410 from TI features a GaN FET with a breakdown voltage of 80V for a current of 10A (25°C). The transistor is
driven by a National Semiconductors silicon IC Gate driver with 1 µm technology node.
The epitaxy structure is composed of different GaN and AlGaN layers and multiple heterojunction structure of AlGaN between
GaN and the AlN layer. A complex buffer and template layers’ structure is used to reduce the stress and the dislocation.
Based on a complete teardown analysis, the report also provides an estimation of the production cost of the IC Gate driver, the
FET and the package.
Moreover, the report proposes a comparison with the GaN Systems, Transphorm and Panasonic packaging and epitaxy. This
comparison highlights the differences in design and manufacturing process and their impact on device size and production
cost.

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Synthesis of the Physical Analysis
Package QFM:
o Advanced multichip packaging
o Dimensions: 6mm x 8mm x2mm
o Number of Pins: x pin
FET:
o Dimension: xxxmm x xxxmm = xxx mm²
o Electrical Connection: xxx
o Placement in the package: xxx on copper lead
frame.
Package
IC
Package opening – Optical View
IC:
o Dimension: xxx mm² (xxxmm x xxmm)
o Electrical Connection: xxx
o Placement in the package: xxx.
GaN FET

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Package Opening – From back side
Package Opening – Cu layer #3
Package Opening – Cu layer #4
Package Opening – Vias #2
• Micro vias: xxx

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Device design
Package Opening

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Package Cross-Section
Package cross section FET– Cross section #1 - Optical View
Package cross section FET– Cross section #1 - Optical View Package cross section FET– Cross section #1 - SEM View
HEMT
Solder balls
Solder balls
HEMT HEMT

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Package Cross-Section
Package cross section IC– Cross section #3 - SEM View

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Package Cross-Section – Laminate Substrate
• The package laminate is a xxx layers PCB.
 PCB thickness: xxx µm
 Copper layers thickness: xxxµm
 Microvia diameter: xxxxµm
Substrate Cross-Section – SEM View
©2017 by System Plus Consulting

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
xxxmm
FET die Dimensions
FET Die – Optical view
o Die dimensions: xxx mm² (xxxmm x xxxmm)
o There is this no marking on the die
xxx mm
source
source
Drain
Drain
Gate

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die process
Transistor process after delayering – SEM View
Transistor process after delayering – SEM View

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die cross section
Die cross section – SEM View
o Substrate thickness: xxx µm
xxx µmSi Substrate

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die cross section

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die cross section – Gate & source
xxx µm
xxx µm
xxxµm

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die cross section -Gate

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
EDX epitaxy

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
xxxmm
IC die Dimensions
IC Die Overview
o Die dimensions: xxx mm²
(xxxmm x xxxmm)
o Connected pads: 12
xxx mm

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die Process
LDMOS transistors are present on the circuit.
Die process– SEM View
Die process– SEM View

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die cross section
o Substrate thickness: xxx µm
xxx µm

Chain
Physical Analysis
o Synthesis
o Package
o GaN FET
o IC
Cost Analysis
Comparison
Feedback
About System Plus
Die cross section
The process uses 3 metal layers in Aluminum with planarization
There are tungsten plugs between the metal layers.
M2 (Al)
M1 (Al)
M3 (Al)

Chain
Physical Analysis
o FET Fab Unit
o FET Process Flow
o IC Fab Unit
o Packaging Fab Unit
Cost Analysis
Comparison
Feedback
About System Plus
GaN Transistor - Process Flow (2/4)
Implantation
•Implantation in the
AlGaN layer
•Implantation in the
gate GaN layer
Gate
•Pattern and GaN
etching
Gate
•TiN deposition
•Pattern Gate Metal
Drawing not to Scale
TiN

Chain
Physical Analysis
o FET Fab Unit
o FET Process Flow
o IC Fab Unit
o Packaging Fab Unit
Cost Analysis
Comparison
Feedback
About System Plus
GaN Transistor - Solder Bumps
Solder Bumps
•Probe test
•Polyimide deposition
and pattern
•UBM
Solder Bumps
• Solder bumps
electroplating
• Solder reflow
Dicing
• Dicing
Drawing not to Scale
presaw
Solder bumps
UBM
Solder bumps

Chain
Physical Analysis
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
Comparison
Feedback
About System Plus
FET - Yields Hypotheses
In our simulation, we assume a development and a production ramp up without important technical problem.

Chain
Physical Analysis
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
Comparison
Feedback
About System Plus
Wafer Front-End Cost
The front-end cost ranges from $xxx to $xxx according to
yield variations.
The main part of the wafer cost is due to the xxxx with
xxx%. The epitaxy steps represent a large part of
consumable and equipment cost (see details in the
following pages).

Chain
Physical Analysis
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
Comparison
Feedback
About System Plus
FET Wafer Cost per process steps

Chain
Physical Analysis
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
Comparison
Feedback
About System Plus
FET Die Cost
The FET Component cost ranges from $xxx to $xxx
according to yield variations.
The Front-end manufacturing represents xxx% of the
component cost (medium yield estimation).
Probe test, dicing and scrap account for xxxx% of the
component cost.
61%
6%
6%
0%
27%
Die Cost Breakdown (Medium Yield)
Front-End Cost BE : Solder Bumps Cost
BE : Probe Test BE : Dicing Cost
BE : Yield losses
Cost Breakdown Cost Breakdown Cost Breakdown
Front-End Cost $1 272.78 82.7% $1 256.79 83.1% $1 234.24 83.5%
BE : Solder bumps Cost $129.73 8.4% $118.21 7.8% $106.79 7.2%
BE : Probe Test Cost $129.73 8.4% $129.73 8.6% $129.73 8.8%
BE : Dicing Cost $7.41 0.5% $7.41 0.5% $7.41 0.5%
Total Wafer Cost $1 539.64 100% $1 512.13 100% $1 478.17 100%
Nb of potential dies per wafer 3 884 3 884 3 884
Nb of good dies per wafer 2 650 2 854 3 060
Front-End Cost $0.328 56.4% $0.324 61.1% $0.318 65.8%
BE : Solder Bumps Cost $0.033 5.7% $0.030 5.7% $0.027 5.7%
BE : Probe Test $0.033 5.7% $0.033 6.3% $0.033 6.9%
BE : Dicing Cost $0.002 0.3% $0.002 0.4% $0.002 0.4%
BE : Yield losses $0.185 31.8% $0.141 26.5% $0.102 21.2%
Die Cost $0.581 100% $0.530 100% $0.483 100%
Low Yield Medium Yield High Yield

Chain
Physical Analysis
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
Comparison
Feedback
About System Plus
68%
4%
1%
12%
2%
13%
Die Cost Breakdown (Medium Yield)
Front-End Cost BE : Probe Test BE : Backgrinding Cost
BE : Bumping Cost BE : Dicing Cost BE : Yield losses
IC Die Cost
The die cost is estimated between $xxx and $xxx according to the yield.
Silicon cost accounts for xxx% of the cost.
The probe test, backgrinding and dicing represent xxx% of the cost.
The scrap cost (xxx%) is the total of all the losses during the back-end process.
Front-End Cost $225.61 79.1% $223.23 79.0% $220.91 78.8%
BE : Probe Test Cost $11.54 4.0% $11.54 4.1% $11.54 4.1%
BE : Backgrinding Cost $2.11 0.7% $2.11 0.7% $2.11 0.8%
BE : Bumping Cost $40.47 14.2% $40.47 14.3% $40.47 14.4%
BE : Dicing Cost $5.38 1.9% $5.38 1.9% $5.38 1.9%
Total Wafer Cost $285.11 100% $282.73 100% $280.41 100%
Nb of potential dies per wafer 4 460 4 460 4 460
Nb of good dies per wafer 3 774 3 863 3 952
Front-End Cost $0.051 67.0% $0.050 68.4% $0.050 69.8%
BE : Probe Test $0.003 3.4% $0.003 3.5% $0.003 3.6%
BE : Backgrinding Cost $0.000 0.6% $0.000 0.6% $0.000 0.7%
BE : Bumping Cost $0.009 12.0% $0.009 12.4% $0.009 12.8%
BE : Dicing Cost $0.001 1.6% $0.001 1.6% $0.001 1.7%
BE : Yield losses $0.012 15.4% $0.010 13.4% $0.008 11.4%
Die Cost $0.076 100% $0.073 100% $0.071 100%

Chain
Physical Analysis
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
Comparison
Feedback
About System Plus
Unpacking PCB + dies $0.0000 0.0% $0.0000 0.0% $0.0000 0.0%
Cleaning PCB $0.0600 7.6% $0.0600 7.8% $0.0600 8.0%
Dispense $0.1400 17.8% $0.1400 18.2% $0.1400 18.6%
Flip chip FET $0.0100 1.3% $0.0100 1.3% $0.0100 1.3%
Flip chip ASIC $0.0100 1.3% $0.0100 1.3% $0.0100 1.3%
Placing Capa $0.0000 0.0% $0.0000 0.0% $0.0000 0.0%
Reflow of die on PCB $0.0500 6.4% $0.0500 6.5% $0.0500 6.7%
Void test (X-Ray inspection ) $0.0200 2.5% $0.0200 2.6% $0.0200 2.7%
Underfill $0.2000 25.5% $0.2000 26.1% $0.2000 26.6%
Curing $0.0900 11.5% $0.0900 11.7% $0.0900 12.0%
DBC+die Cleaning + rinsing + drying $0.0800 10.2% $0.0800 10.4% $0.0800 10.6%
Encapsulation molding $0.0200 2.5% $0.0200 2.6% $0.0200 2.7%
Post-mold Curing $0.0100 1.3% $0.0100 1.3% $0.0100 1.3%
Yield losses Cost $0.0946 12.1% $0.0774 10.1% $0.0617 8.2%
Package Manufacturing Cost $0.785 100% $0.767 100% $0.752 100%
Package Manufacturing
Packaging Cost
FET Die Cost $1.162 $1.060 $0.966
ASIC Die Cost $0.0755 $0.0732 $0.0710
PCB Cost $0.6800 $0.6800 $0.6800

Chain
Physical Analysis
Cost Analysis
o Synthesis
o Die Cost
o Packaging Cost
o Component Cost
Comparison
Feedback
About System Plus
Component Cost
The component cost ranges from $xxx to $xxx according
to yield variations.
The FET die manufacturing represents xxx% of the
component cost.
The IC die manufacturing represents xxx% of the
component cost.
The packaging represents xxx% of the component cost.
Final test and yield losses account for xxx% of the
component cost.
FET Die cost $1.162 54.4% $1.060 53.0% $0.966 51.5%
ASIC Die Cost $0.076 3.5% $0.073 3.7% $0.071 3.8%
Packaging cost $0.785 36.7% $0.767 38.4% $0.752 40.1%
Final test & Calibration cost $0.060 2.8% $0.060 3.0% $0.060 3.2%
Yield losses cost $0.053 2.5% $0.040 2.0% $0.028 1.5%
Component Cost $2.135 100% $2.000 100% $1.877 100%
53%
4%
38%
3% 2%
Component Cost Breakdown (Medium Yield)
FET Die cost ASIC Die Cost
Packaging cost Final test & Calibration cost
Yield losses cost

Chain
Physical Analysis
Cost Analysis
Comparison
Feedback
About System Plus
Estimated Manufacturer Price
The component manufacturing cost ranges
from $xxx to $xxx according to yield variations.
The component selling price ranges from $xx
to $xxxx according to yield variations.
Gross Margin 61.7%
TI
Component cost $2.135 $2.000 $1.877
Manufacturer Gross Profit $3.440 +62% $3.222 +62% $3.024 +62%
Component price $5.576 $5.223 $4.901
$ 0.000
$ 1.000
$ 2.000
$ 3.000
$ 4.000
$ 5.000
$ 6.000
$ 2.135 $ 2.000 $ 1.877
$ 5.576
$ 5.223
$ 4.901
Cost & Price According to Yield Variation
Component cost Component price

Chain
Physical Analysis
Cost Analysis
Comparison
o Transphorm, GaN System
and Panasonic 600V GaN
FET
Feedback
About System Plus
Comparison between Transphorm, GaN Systems,Panasonic and TI GaN FET package
FET Packaging Size Pakage Cost
PGA26E19BA DFN 8 8x8x1.25 $xx
GS66504B GaNpx embedded 8.7x10x0.47 $xx
TPH3206PS TO220D cascode 14x10x4.5 $xx
LMG5200 QFM 8x6x0.9 $xx
PGA26E19BA
TPH3206PS
GS66504B
The packaging has an high impact on the
final cost and performances of the
devices.
The device of TI, even if it has an
integrated driver, the cost competitive.
TI LMG5200

Chain
Physical Analysis
Cost Analysis
Comparison
Feedback
About System Plus
o Company services
o Related reports
o Contact
o Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Power Semiconductors & Compound
• Panasonic PGA26C09DV 600V GaN HEMT
• Transphorm TPH3002PS 600V GaN on Silicon HEMT
• GaN Systems – 650V GaN on Silicon HEMT AT&S ECP®
Embedded Power Die Package
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
POWER ELECTRONICS
• Power GaN 2017: Epitaxy, Devices, Applications, and Technology
Trends
• Gate Driver Market and Technology Trends 2017
PATENT ANALYSIS - KNOWMADE
POWER ELECTRONICS
• GaN Devices for Power Electronics Patent Investigation

COMPANY
SERVICES

Chain
Physical Analysis
Cost Analysis
Comparison
Feedback
About System Plus
o Company services
o Related reports
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings

Chain
Physical Analysis
Cost Analysis
Comparison
Feedback
About System Plus
o Company services
o Related reports
o Contact
o Legal
Contact
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