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Sensirion SGP30 Gas Sensor
Multi-Pixel Gas Sensor
MEMS report by LE BLEIS Clément
February 2018 – Version 1
©2018 by System Plus Consulting | Sensirion SGP30 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Sensirion
o Market Analysis
o SGP30 Datasheet
Physical Analysis 19
o Summary of the Physical Analysis 20
o Physical Analysis Methodology 21
o Operating Principle 22
o Package 34
 View & Dimensions
 Marking
 Power Supply
 Venting Hole
 Package Opening
 Cross-Section
o Sensor Die 41
 View & Dimensions
 Membrane Composition
 Cross-Section
 Working Assumption
o ASIC Die 60
 View & Dimensions
 Delayering & Main Blocks
 Die Process
 Die Cross-Section
 Die Process Characteristics
Physical Comparison 75
Sensor Manufacturing Process 82
o Global Overview
o ASIC Front-End Process
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication Unit
o Packaging Process
Cost Analysis 100
o Summary of the cost analysis 101
o Main Steps of economic analysis 102
o Yields Explanation & Hypotheses 103
o ASIC 105
 ASIC Front-End Cost
o MEMS 106
 MEMS Front-End Cost
 MEMS Back-End :Probe Test & Dicing
 MEMS Wafer & Die Cost
o Packaging Cost
o Back-End : Final Test
o Component Cost
Selling Price 115
o Definition of Price
o Estimated Manufacturer Price
Feedback 120
Company services 122
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data, manufacturing, cost and selling
price of the SGP30 Gas Sensor made by Sensirion.
• Sensirion has released a complete sensor system SGP integrated into a small 2.45 x 2.45 x 0.9 mm DFN package. With
these dimensions, it can be embedded in any smartphone, smart-home and appliance applications to measure indoor air
environment (CO2), consumer product (Siloxane) and volatile organic compound (VOCs) in real-time.
• Sensirion has developed “Pixel” technology which consist to detect different gases like CO2, VOCs and particulate matter
on the common membrane including multiple metal-oxide in the same component. To reduce the component size,
Sensirion placed the gas sensor above the ASIC and packaged it with the same mold compound, gaining certain advantages
like a reduced number of bonds, and an increased signal-to-noise ratio. With specific material and layout choices, the
SGP30 embeds the heater and electrodes within the ASIC. Despite the high current and temperature generated, signal
measurement is preserved from these disturbances. The electrode and heater are managed by the ASIC, which includes a
temperature sensor for measuring the membrane’s temperature, along with flash memory for data calibration. In order to
preserve the gas sensing cell in time, a white membrane with a special material is pasted to the top of the package
allowing gases to pass through.
• With this low cost gas sensor, Sensirion SGP multi-pixel are suitable for several environmental applications in order to
improve comfort and well-being, as well as energy efficiency. With one biggest advantage to have a small size under 5.5
mm3 these can be embedded in any low power portable system.
©2018 by System Plus Consulting | Sensirion SGP30 4
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price
Executive Summary
©2018 by System Plus Consulting | Sensirion SGP30 5
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Summary of the Physical Analysis
©2018 by System Plus Consulting | Sensirion SGP30 6
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Packaging : Views & Dimensions
• Package : 6-pin DFN
• Dimensions : 2.45 x 2.45 x 0.9 mm
• Pin Pitch : 0.8 mm
2.45 mm
2.45mm
0.9mm
Sensirion SGP30 - Top View
©2018 by System Plus Consulting
Sensirion SGP30 - Side View
©2018 by System Plus Consulting
Sensirion SGP30 - Bottom View
©2018 by System Plus Consulting
1.22mm
0.8mm
©2018 by System Plus Consulting | Sensirion SGP30 7
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Package Opening
©2018 by System Plus Consulting | Sensirion SGP30 8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Package Cross-Section
©2018 by System Plus Consulting | Sensirion SGP30 9
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die : Membrane Composition
©2018 by System Plus Consulting | Sensirion SGP30 10
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die : Cross-Section
©2018 by System Plus Consulting | Sensirion SGP30 11
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
ASIC Die : Dimensions
©2018 by System Plus Consulting | Sensirion SGP30 12
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Physical Analysis
o Operating Principle
o Packaging
o Sensor Die
o Working Assumption
o ASIC Die
o ASIC Process Characteristics
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
ASIC Die Cross-Section
©2018 by System Plus Consulting | Sensirion SGP30 13
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
o Comparison with Bosch
BME680, SGP30 & AMS MLV-
P2
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Comparison with SGP30, AMS AS-MLV-P2 and Bosch BME680
©2018 by System Plus Consulting | Sensirion SGP30 14
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Front-End Process
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Global Overview
©2018 by System Plus Consulting | Sensirion SGP30 15
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Front-End Process
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Front-End Process
©2018 by System Plus Consulting | Sensirion SGP30 16
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Front-End Process
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Sensor Process Flow
©2018 by System Plus Consulting | Sensirion SGP30 17
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Front-End Process
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Packaging Process Flow
©2018 by System Plus Consulting | Sensirion SGP30 18
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Summary
o Economic Analysis
o Yields
o ASIC & Wafer Die Cost
o MEMS & Wafer Die Cost
o Packaging Cost
o Back-End Cost
o Component Cost
Selling Price Analysis
Feedbacks
About System Plus
ASIC Unprobed Front-End Cost
©2018 by System Plus Consulting | Sensirion SGP30 19
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Summary
o Economic Analysis
o Yields
o ASIC & Wafer Die Cost
o MEMS & Wafer Die Cost
o Packaging Cost
o Back-End Cost
o Component Cost
Selling Price Analysis
Feedbacks
About System Plus
MEMS Front-End Cost
©2018 by System Plus Consulting | Sensirion SGP30 20
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Summary
o Economic Analysis
o Yields
o ASIC & Wafer Die Cost
o MEMS & Wafer Die Cost
o Packaging Cost
o Back-End Cost
o Component Cost
Selling Price Analysis
Feedbacks
About System Plus
Component Cost
©2018 by System Plus Consulting | Sensirion SGP30 21
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Gas Sensor
• Cambridge CMOS Sensor CCS801
• Bosch BME680 sensor with integrated Gas sensor
• AMS-MLV-P2 Gas Sensor
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
Gas Sensor market analysis
• Gas sensor Technology and Market
COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing
process flow
• Supply chain
evaluation
• Manufacturing cost
analysis
• Estimated sales price
• Comparison with ams
and Bosch gas sensors
SGP30 Gas Sensor from Sensirion
Title: Sensirion SGP30
Gas Sensor
Pages: 125
Date: February 2018
Format: PDF & Excel file
Price: EUR 3,490
The first monolithic multi-gas sensor from Sensirion, with a unique
and innovative design using metal oxide technology
embedded in virtually any low-power system. Sensirion’s “Multi-Pixel” technology
focuses on detecting different gases like CO2 and VOCs on a common membrane, using
multiple metal-oxide in the same component.
To reduce the component size, Sensirion placed the gas sensor above the ASIC and
packaged it with the same mold compound, gaining certain advantages like a reduced
number of bonds, and an increased signal-to-noise ratio. With specific material and
layout choices, the SGP30 embeds the heater and electrodes within the ASIC. Despite the
high current and temperature generated, signal measurement is preserved from these
disturbances. The electrode and heater are managed by the ASIC, which includes a
temperature sensor for measuring the membrane’s temperature, along with flash
memory for data calibration.
This report analyzes Sensirion’s entire component, including the package, MEMS, and
ASIC die developed by the company. It also provides a full description of the ASIC and
MEMS functionalities, and details the manufacturing processes used.
A complete cost analysis and estimated sales price for the SGP30 gas sensor is included
too, along with a comparison between ams’ AS-MLV-P2, ams's CCS801 and Bosch’s
BME680 gas sensor.
Sensirion, a leading manufacturer of digital
microsensors and systems, recently released a
gas sensor designed for consumer and
appliance applications: the SGP30 Multi-Pixel.
The SGP30 gas sensor is a new kind of sensor
which measures different gas types in any
environment. With a DFN package volume
under 5.5 mm3, this gas sensor can be
embedded in a variety of low-power systems,
including smartphones, tablets, and laptops.
Boasting an innovative design based on metal
oxide technology, the SGP30 is Sensirion’s first
multi-gas sensor. Enclosed in a small DFN 2.45 x
2.45 mm molded package, this sensor can be
Structure, Process & Cost Analysis
Reverse Costing®
TABLE OF CONTENTS
Overview /Introduction
Sensirion - Company Profile
Physical Analysis
• Physical Analysis Methodology
• Sensor Package
 View and dimensions
 Package Opening
 Sensor Package Cross-Section
• MEMS/ASIC Die
 View, Dimensions, and Markings
 Cross-Section: Metal Layers,
Transistor, Capacitor
 Die Metal De-processing
 Die Delayering, Main Block ID, and
Process
 Die-Process Characteristics
• Comparison with ams and Bosch
AUTHORS:
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price from single
chip to complex structures.
MEMS CoSim+
Cost simulation tool to
evaluate the cost of any
MEMS process or device:
From single chip to complex
structures.
IC Price+
The tool performs the
necessary cost simulation of
any Integrated Circuit: ASICs,
microcontrollers, DSP,
memories, smartpower…
MEMS CoSim+
IC Price+
Manufacturing Process Flow
• Wafer Fabrication Unit
• Front-End Process
• Final Assembly Unit
Cost Analysis
• Cost Analysis Overview
• Main Steps Used in the
Economic Analysis
• Yield Hypotheses
• ASIC
 Front-End Cost
• MEMS
 Front-End Cost
• Back-End Cost
• Packaging Cost
• Component Cost
Selling Price
engineer. Coming from Atmel
Nantes, she has extensive
knowledge in failure analysis
of components and in
deprocessing of Integrated
Circuits.
Véronique
Le Troadec (Lab)
Véronique has
joined System
Plus Consulting as
a l a b o r a t o r y
Performed by
Clément is graduated with a
bachelor in radioprotection
and electronics, completed
with a master degree in
electronic components in
Nantes in 2017. He is in
charge of costing of MEMS
and Integrated Circuits.
Clément Le Bleis
Clément Le Bleis
has joined System
Plus Consulting in
November.
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Pages: 86
Date: October 2015
Full report: EUR 2,990*
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Full report: EUR 3,490*
Pages: 138
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4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
Distributed by
©2018 by System Plus Consulting | Sensirion SGP30 22
COMPANY
SERVICES
©2018 by System Plus Consulting | Sensirion SGP30 23
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings
©2018 by System Plus Consulting | Sensirion SGP30 24
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
Contact
Headquarters
21 rue La Noue Bras de Fer
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
America Sales Office
Steve LAFERRIERE
Phoenix
USA
(310) 600-8267
laferriere@yole.fr
www.systemplus.fr
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
onozawa@yole.fr
Mavis WANG
GREATER CHINA
wang@yole.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europa Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
PHOENIX
YOLE Inc.
KOREA
YOLE

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Sensirion SGP30 Gas Sensor 2018 - teardown reverse costing report published by System Plus Consulting

  • 1. 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr Sensirion SGP30 Gas Sensor Multi-Pixel Gas Sensor MEMS report by LE BLEIS Clément February 2018 – Version 1
  • 2. ©2018 by System Plus Consulting | Sensirion SGP30 2 Table of Contents Overview / Introduction 4 o Executive Summary o Reverse Costing Methodology Company Profile 8 o Sensirion o Market Analysis o SGP30 Datasheet Physical Analysis 19 o Summary of the Physical Analysis 20 o Physical Analysis Methodology 21 o Operating Principle 22 o Package 34  View & Dimensions  Marking  Power Supply  Venting Hole  Package Opening  Cross-Section o Sensor Die 41  View & Dimensions  Membrane Composition  Cross-Section  Working Assumption o ASIC Die 60  View & Dimensions  Delayering & Main Blocks  Die Process  Die Cross-Section  Die Process Characteristics Physical Comparison 75 Sensor Manufacturing Process 82 o Global Overview o ASIC Front-End Process o ASIC Wafer Fabrication Unit o MEMS Front-End Process o MEMS Wafer Fabrication Unit o Packaging Process Cost Analysis 100 o Summary of the cost analysis 101 o Main Steps of economic analysis 102 o Yields Explanation & Hypotheses 103 o ASIC 105  ASIC Front-End Cost o MEMS 106  MEMS Front-End Cost  MEMS Back-End :Probe Test & Dicing  MEMS Wafer & Die Cost o Packaging Cost o Back-End : Final Test o Component Cost Selling Price 115 o Definition of Price o Estimated Manufacturer Price Feedback 120 Company services 122
  • 3. Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, manufacturing, cost and selling price of the SGP30 Gas Sensor made by Sensirion. • Sensirion has released a complete sensor system SGP integrated into a small 2.45 x 2.45 x 0.9 mm DFN package. With these dimensions, it can be embedded in any smartphone, smart-home and appliance applications to measure indoor air environment (CO2), consumer product (Siloxane) and volatile organic compound (VOCs) in real-time. • Sensirion has developed “Pixel” technology which consist to detect different gases like CO2, VOCs and particulate matter on the common membrane including multiple metal-oxide in the same component. To reduce the component size, Sensirion placed the gas sensor above the ASIC and packaged it with the same mold compound, gaining certain advantages like a reduced number of bonds, and an increased signal-to-noise ratio. With specific material and layout choices, the SGP30 embeds the heater and electrodes within the ASIC. Despite the high current and temperature generated, signal measurement is preserved from these disturbances. The electrode and heater are managed by the ASIC, which includes a temperature sensor for measuring the membrane’s temperature, along with flash memory for data calibration. In order to preserve the gas sensing cell in time, a white membrane with a special material is pasted to the top of the package allowing gases to pass through. • With this low cost gas sensor, Sensirion SGP multi-pixel are suitable for several environmental applications in order to improve comfort and well-being, as well as energy efficiency. With one biggest advantage to have a small size under 5.5 mm3 these can be embedded in any low power portable system.
  • 4. ©2018 by System Plus Consulting | Sensirion SGP30 4 Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus The reverse costing analysis is conducted in 3 phases: Teardown analysis • Package is analyzed and measured • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking • Setup of the manufacturing process. Costing analysis • Setup of the manufacturing environment • Cost simulation of the process steps Selling price analysis • Supply chain analysis • Analysis of the selling price Executive Summary
  • 5. ©2018 by System Plus Consulting | Sensirion SGP30 5 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Summary of the Physical Analysis
  • 6. ©2018 by System Plus Consulting | Sensirion SGP30 6 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Packaging : Views & Dimensions • Package : 6-pin DFN • Dimensions : 2.45 x 2.45 x 0.9 mm • Pin Pitch : 0.8 mm 2.45 mm 2.45mm 0.9mm Sensirion SGP30 - Top View ©2018 by System Plus Consulting Sensirion SGP30 - Side View ©2018 by System Plus Consulting Sensirion SGP30 - Bottom View ©2018 by System Plus Consulting 1.22mm 0.8mm
  • 7. ©2018 by System Plus Consulting | Sensirion SGP30 7 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Package Opening
  • 8. ©2018 by System Plus Consulting | Sensirion SGP30 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Package Cross-Section
  • 9. ©2018 by System Plus Consulting | Sensirion SGP30 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Sensor Die : Membrane Composition
  • 10. ©2018 by System Plus Consulting | Sensirion SGP30 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Sensor Die : Cross-Section
  • 11. ©2018 by System Plus Consulting | Sensirion SGP30 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ASIC Die : Dimensions
  • 12. ©2018 by System Plus Consulting | Sensirion SGP30 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Physical Analysis o Operating Principle o Packaging o Sensor Die o Working Assumption o ASIC Die o ASIC Process Characteristics Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ASIC Die Cross-Section
  • 13. ©2018 by System Plus Consulting | Sensirion SGP30 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison o Comparison with Bosch BME680, SGP30 & AMS MLV- P2 Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Comparison with SGP30, AMS AS-MLV-P2 and Bosch BME680
  • 14. ©2018 by System Plus Consulting | Sensirion SGP30 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow o Global Overview o ASIC Front-End Process o ASIC Wafer Fabrication Unit o MEMS Front-End Process o MEMS Wafer Fabrication Unit o MEMS Sensor Process Flow o Package Assembly Unit o Packaging Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Global Overview
  • 15. ©2018 by System Plus Consulting | Sensirion SGP30 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow o Global Overview o ASIC Front-End Process o ASIC Wafer Fabrication Unit o MEMS Front-End Process o MEMS Wafer Fabrication Unit o MEMS Sensor Process Flow o Package Assembly Unit o Packaging Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus MEMS Front-End Process
  • 16. ©2018 by System Plus Consulting | Sensirion SGP30 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow o Global Overview o ASIC Front-End Process o ASIC Wafer Fabrication Unit o MEMS Front-End Process o MEMS Wafer Fabrication Unit o MEMS Sensor Process Flow o Package Assembly Unit o Packaging Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus MEMS Sensor Process Flow
  • 17. ©2018 by System Plus Consulting | Sensirion SGP30 17 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow o Global Overview o ASIC Front-End Process o ASIC Wafer Fabrication Unit o MEMS Front-End Process o MEMS Wafer Fabrication Unit o MEMS Sensor Process Flow o Package Assembly Unit o Packaging Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus Packaging Process Flow
  • 18. ©2018 by System Plus Consulting | Sensirion SGP30 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Summary o Economic Analysis o Yields o ASIC & Wafer Die Cost o MEMS & Wafer Die Cost o Packaging Cost o Back-End Cost o Component Cost Selling Price Analysis Feedbacks About System Plus ASIC Unprobed Front-End Cost
  • 19. ©2018 by System Plus Consulting | Sensirion SGP30 19 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Summary o Economic Analysis o Yields o ASIC & Wafer Die Cost o MEMS & Wafer Die Cost o Packaging Cost o Back-End Cost o Component Cost Selling Price Analysis Feedbacks About System Plus MEMS Front-End Cost
  • 20. ©2018 by System Plus Consulting | Sensirion SGP30 20 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Summary o Economic Analysis o Yields o ASIC & Wafer Die Cost o MEMS & Wafer Die Cost o Packaging Cost o Back-End Cost o Component Cost Selling Price Analysis Feedbacks About System Plus Component Cost
  • 21. ©2018 by System Plus Consulting | Sensirion SGP30 21 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus o Company services o Related reports o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING Related Reports REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING Gas Sensor • Cambridge CMOS Sensor CCS801 • Bosch BME680 sensor with integrated Gas sensor • AMS-MLV-P2 Gas Sensor MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Gas Sensor market analysis • Gas sensor Technology and Market
  • 22. COMPLETE TEARDOWN WITH: • Detailed photos • Precise measurements • Materials analysis • Manufacturing process flow • Supply chain evaluation • Manufacturing cost analysis • Estimated sales price • Comparison with ams and Bosch gas sensors SGP30 Gas Sensor from Sensirion Title: Sensirion SGP30 Gas Sensor Pages: 125 Date: February 2018 Format: PDF & Excel file Price: EUR 3,490 The first monolithic multi-gas sensor from Sensirion, with a unique and innovative design using metal oxide technology embedded in virtually any low-power system. Sensirion’s “Multi-Pixel” technology focuses on detecting different gases like CO2 and VOCs on a common membrane, using multiple metal-oxide in the same component. To reduce the component size, Sensirion placed the gas sensor above the ASIC and packaged it with the same mold compound, gaining certain advantages like a reduced number of bonds, and an increased signal-to-noise ratio. With specific material and layout choices, the SGP30 embeds the heater and electrodes within the ASIC. Despite the high current and temperature generated, signal measurement is preserved from these disturbances. The electrode and heater are managed by the ASIC, which includes a temperature sensor for measuring the membrane’s temperature, along with flash memory for data calibration. This report analyzes Sensirion’s entire component, including the package, MEMS, and ASIC die developed by the company. It also provides a full description of the ASIC and MEMS functionalities, and details the manufacturing processes used. A complete cost analysis and estimated sales price for the SGP30 gas sensor is included too, along with a comparison between ams’ AS-MLV-P2, ams's CCS801 and Bosch’s BME680 gas sensor. Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops. Boasting an innovative design based on metal oxide technology, the SGP30 is Sensirion’s first multi-gas sensor. Enclosed in a small DFN 2.45 x 2.45 mm molded package, this sensor can be Structure, Process & Cost Analysis Reverse Costing®
  • 23. TABLE OF CONTENTS Overview /Introduction Sensirion - Company Profile Physical Analysis • Physical Analysis Methodology • Sensor Package  View and dimensions  Package Opening  Sensor Package Cross-Section • MEMS/ASIC Die  View, Dimensions, and Markings  Cross-Section: Metal Layers, Transistor, Capacitor  Die Metal De-processing  Die Delayering, Main Block ID, and Process  Die-Process Characteristics • Comparison with ams and Bosch AUTHORS: ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+ System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from single chip to complex structures. MEMS CoSim+ Cost simulation tool to evaluate the cost of any MEMS process or device: From single chip to complex structures. IC Price+ The tool performs the necessary cost simulation of any Integrated Circuit: ASICs, microcontrollers, DSP, memories, smartpower… MEMS CoSim+ IC Price+ Manufacturing Process Flow • Wafer Fabrication Unit • Front-End Process • Final Assembly Unit Cost Analysis • Cost Analysis Overview • Main Steps Used in the Economic Analysis • Yield Hypotheses • ASIC  Front-End Cost • MEMS  Front-End Cost • Back-End Cost • Packaging Cost • Component Cost Selling Price engineer. Coming from Atmel Nantes, she has extensive knowledge in failure analysis of components and in deprocessing of Integrated Circuits. Véronique Le Troadec (Lab) Véronique has joined System Plus Consulting as a l a b o r a t o r y Performed by Clément is graduated with a bachelor in radioprotection and electronics, completed with a master degree in electronic components in Nantes in 2017. He is in charge of costing of MEMS and Integrated Circuits. Clément Le Bleis Clément Le Bleis has joined System Plus Consulting in November. Distributed by
  • 24. RELATED REPORTS ANNUAL SUBSCRIPTION OFFER You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! • MEMS & Sensors: Accelerometer - Environment - Fingerprint - Gas - Gyroscope - IMU/Combo - Microphone - Optics - Oscillator - Pressure • Power: GaN - IGBT - MOSFET - Si Diode - SiC • Imaging: Camera - Spectrometer • LED & Laser: UV LED - VCSEL - White/blue LED Each year System Plus Consulting releases a comprehensive collection of new reverse engineering & costing analyses in various domains. • Packaging: 3D Packaging - Embedded - SIP - WLP • Integrated Circuits : IPD - Memories - PMIC - SoC • RF: FEM - Duplexer • Systems: Automotive - Consumer - Energy - Telecom More than 60 reports released each year on the following topics (considered for 2018): Cambridge CMOS Sensor CCS801 – VOC MEMS Gas Sensor Bosch BME680 Environmental Sensor with Integrated Gas Sensor Gas Sensor Technology and Market First ultra low power gas sensor for the portable handheld devices. The world's first environmental sensor combining gas, pressure, humidity and temperature sensing functions in a 3mm x 3mm footprint package. Disruptive technologies and emerging applications will make the gas sensor market skyrocket! Pages: 86 Date: October 2015 Full report: EUR 2,990* Pages: 152 Date: July 2017 Full report: EUR 3,490* Pages: 138 Date: February 2016 Full report: EUR 6,490* Performed byDistributed by
  • 25. ORDER FORM  Full Reverse Costing report: EUR 3,490* *For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT. Performed by DELIVERY on receipt of payment: By credit card: Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__| Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__| By bank transfer: BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code : 30056, Branch code : 00170 Account No : 0170 200 1565 87, SWIFT or BIC code : CCFRFRPP, IBAN : FR76 3005 6001 7001 7020 0156 587 Return order by: • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DEVELOPPEMENT, 75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne Contact: • Japan: Miho - Ohtake@yole.fr • Greater China: Mavis - Wang@yole.fr • Asia: Takashi - Onozawa@yole.fr • EMEA: Lizzie - Levenez@yole.fr • North America: Steve – laferriere@yole.fr • General: info@yole.fr The present document is valid till February, 2019 SHIP TO PAYMENT BILLING CONTACT ABOUT YOLE DEVELOPPEMENT Name (Mr/Ms/Dr/Pr): ...................................................................................... Job Title: ...................................................................................... Company: ...................................................................................... Address: ...................................................................................... City: State: ...................................................................................... Postcode/Zip: ...................................................................................... Country: ...................................................................................... VAT ID Number for EU members: ...................................................................................... Tel: ...................................................................................... Email: ..................................................................................... Date: ....................................................................................... Signature: ...................................................................................... Distributed by First Name: .................................................................. Last Name: ............................................................................ Email:............................................................................ Phone:..................................................................................... Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. CUSTOM STUDIES • Market data & research, marketing analysis • Technology analysis • Reverse engineering & costing services • Strategy consulting • Patent analysis More information on www.yole.fr MEDIA • i-Micronews.com, online disruptive technologies website and its weekly e- newsletter, @Micronews • Communication & webcasts services • Events: Yole Seminars, Market Briefings More information on http://www.i-micronews.com/media-kit.html TECHNOLOGY & MARKET REPORTS • Collection of technology & market reports • Manufacturing cost simulation tools • Component reverse engineering & costing analysis • Patent investigation More information on http://www.i- micronews.com/reports.html Please process my order for “Sensirion SGP30 Gas Sensor” Report Ref.: SP18372
  • 26. Performed by TERMS AND CONDITIONS OF SALES . Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. 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Termination 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. Miscellaneous All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. Governing law and jurisdiction 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions. Distributed by
  • 27. ©2018 by System Plus Consulting | Sensirion SGP30 22 COMPANY SERVICES
  • 28. ©2018 by System Plus Consulting | Sensirion SGP30 23 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus o Company services o Related reports o Contact o Legal Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings
  • 29. ©2018 by System Plus Consulting | Sensirion SGP30 24 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus o Company services o Related reports o Contact o Legal Contact Headquarters 21 rue La Noue Bras de Fer 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA (310) 600-8267 laferriere@yole.fr www.systemplus.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr NANTES Headquarter FRANKFURT/MAIN Europa Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE PHOENIX YOLE Inc. KOREA YOLE