3D Packaging: A Key Enabler for Further Integration and Performance at European 3D Summit in Grenoble France January 25th, 2017 by Thibault Buisson from Yole Développement
LANDSCAPE OF SENSORS USED IN SMARTPHONE MARKET
Since the advent of smartphones and tablets, the landscape of sensors integrated has really changed…
Manage all the chain is a key advantage…that’s why all OEMs develop their own APU
Package type
InFO
1178-ball PoPBGA
PoP
PoP Process
Pin pitch (mm)
Foundry
TSMC (e)
Samsung
Shinko
TSMC ?
Co-processor (for Sensor fusion)
M10 (e)
ARM Cortex M4
LGA package
WLP
WLCSP
Driven by IoT WLP will be one of the next key trend for MEMS and Sensors devices!
Source: mCube
70% reductionin package size enabledby 3D TSV and WLP
More information on that report at http://www.i-micronews.com/reports.html
Similar to 3D Packaging: A Key Enabler for Further Integration and Performance at European 3D Summit in Grenoble France January 25th, 2017 by Thibault Buisson from Yole Développement
Similar to 3D Packaging: A Key Enabler for Further Integration and Performance at European 3D Summit in Grenoble France January 25th, 2017 by Thibault Buisson from Yole Développement (20)
3D Packaging: A Key Enabler for Further Integration and Performance at European 3D Summit in Grenoble France January 25th, 2017 by Thibault Buisson from Yole Développement
1. From Technologies to Markets
3D Packaging:
A Key Enabler
for Further
Integration
and
Performance
European 3D Summit
Thibault Buisson
Business Unit Manager - buisson@yole.fr
Grenoble | France – January 23-25th, 2017
2. 2
QUICK OUTLINE
oWhat IS and WILL be driving 3D Packaging?
oA closer look…on 3D Packaging Technology
oPackaging Trends
oKey Messages
4. 4
WHAT IS AND WILL BE DRIVING ADVANCED PACKAGING & 3D PACKAGING?
Smartphones
Tablets
…
IoT,Wearables, …
AR/VR handsets
Automotive
Connected cars
Autonomous vehicles…
Datacenters,Networking,
HPC, Photonics
Deep learning
Graphics…Artificial Intelligence
…
5. 5
WHAT IS AND WILL BE DRIVING ADVANCED PACKAGING & 3D PACKAGING?
Smartphones
Tablets
IoT,Wearables, …
AR/VR handsets
Automotive
Connected cars
Autonomous vehicles…
Datacenters,Networking,
HPC
Deep learning
GraphicsArtificial Intelligence
Key Drivers:
Form
Factor
Increase
Functionnalites
Performance
Reduced
Cost
7. 7
Sound
Interface
Security
Communi-
cation
Motion
Environmental
Optical
MEMS AND SENSORS IN MOBILE DEVICES
Security,
sound and
3D Imaging,
the next
value
propositions
of
smartphones
…
@2017 | www.yole.fr | 3D Summit
Capacitive MEMS
Microphone
Piezoelectric MEMS
Microphone
CIS (Front, Rear, Multi, 3D)
Spectral sensing (IR, multispectral)
Autofocus (VCM, liquid
lens, MEMS, piezo)
Particle, gas sensor
Temp. / Humidity sensor
Accelerometer
Gyroscope
Magnetometer
Combos (IMU, eCompass, 9DOF)
Pressure sensor
Antenna tuner, filters, …
MEMS oscillator
Face/Eye/Iris
recognition
Fingerprint
sensor
Laser ranger
3D Touch
ALS, proximity, RGB
Laser ranger
8. 8
LANDSCAPE OF SENSORS USED IN SMARTPHONE MARKET
2007 - 2014
Since the advent of smartphones and tablets, the landscape of sensors integrated has really changed…
@2017 | www.yole.fr | 3D Summit
2007 2014
Accelerometer
Accelerometer
Gyroscope
Magnetometer
3 sensors 12 sensors
Microphone x1
CIS x1
Microphone x2
Pressure
Fingerprint
HRM
CIS x2
ALS
Proximity
2-in-1 (6A-IMU)
2-in-1
9. 9
LANDSCAPE OF SENSORS USED IN SMARTPHONE MARKET
2014 - 2021
With a profusion of sensors
@2017 | www.yole.fr | 3D Summit
2014 2021
Accelerometer
Gyroscope
Magnetometer
12 sensors 20 sensors
ALS
Proximity
RGB
CIS x4
Laser ranger
IR sensor
Fingerprint
HRM
Pressure
Microphone x3
Gas sensor
Accelerometer
Gyroscope
Magnetometer
Microphone x2
Pressure
ALS
Proximity
Fingerprint
HRM
CIS x2
3-in-1
2-in-1 (6A-IMU)2-in-1 (6A-IMU)
2-in-1
24. 24
TO CONCLUDE
o Scaling of transistors is getting more and more complex. To enable solutions, focus is therefore
on Advanced Packaging throught different platforms and mainly on 3D Packaging Platforms.
o Fan Out Packaging has penetrated the middle end market for application processor. It is foreseen
to expand in that segment and possibly for high end market. Several solutions are being proposed by
many players to gain market share.
o Fan Out Packaging may impact the flip chip technology and mainly advanced substrates makers. We
do expect the substrate makers to come-up with more advanced technical specifications.
o Moving to Fan Out Packaging is a strategic decision. Some fabless makers may take their time to
switch to this technology.
o High End market pushed by more demand in performance will continue to see advanced Packaging
technologies emerging.
@2017 | www.yole.fr | 3D Summit